1972 |
- Establishment of HISEM with a capital of RM2 Million. |
1975 |
- Official opening of "HISEM" by Chief Minister of Penang. |
- Production of Bipolar IC. |
1978 |
- Setting up "Small Signal Transistor" Production. |
1980 |
- Setting up of HISET 1st. Subsidiary. |
- Production of MOS Memory. |
1981 |
- Setting up of 2nd. Subsidiary HISAH in Kulim, Kedah. |
- Production of MPAK Transistors. |
1987 |
- Production of memory SOP and Bipolar Digital Devices. |
1988 |
- Production of Silicon Glass Diode and Microprocessor. |
1990 |
- Setting up of Design Center. |
- Production of MPAK Diode. |
1993 |
- HISEM receives the MS ISO9002 accreditation from SIRIM. |
- HISEM celebrates her 20th. Anniversary. |
1994 |
- HISEM receives the "1994 National Occupational Safety & Health" Award from the Prime Minister. |
- HISAH receives the MS ISO9002 accreditation from SIRIM. |
1996 |
- Setting up of the Traning Center. |
1997 |
- Received the Environmental Management System (ISO14001) certification from SIRIM. |
- HISEM celebrates her 25th. Anniversary. |
- Production of UFP Diode. |
|
1999 |
- Received the Prime Minister's Hibiscus Award for notable achievement in environmental performance. |
2000 |
- Received the Occupational Safety & Health Management System (OHSAS18001) certification from SIRIM. |
2001 |
- HISEM Employees Cooperative receives a Quality Award from the Penang Cooperative Development Department. |
2002 |
- Production of Power Transistors. |
|
2003 |
- Hitachi Semiconductor (Malaysia) Sdn. Bhd. - Name was changed to Renesas Semiconductor (Malaysia) Sdn. Bhd. (RSM). |
- Hitachi Semiconductor (Kedah) Sdn. Bhd. - Name was changed to Renesas Semiconductor (Kedah) Sdn. Bhd. (RSK). |
- RSM received a recognition award from the Penang State Department of Irrigation and Drainage for the Environmental project on the placement of trees along the Sungai Ara river bank. |
- RSM Employees Cooperative receives another Quality Award from the Penang Cooperative Development Department. |
- ISO9001:2000 Quality Management System Upgrade. |
2004 |
- Setup of Operator Training Center (OTC). |
- Started WPAK Production. |
- started LFPAK and VQFN Production. |
2005 |
- Expansion of RSM-Design Center to Level 3. |
- Received Green Partner Certificate from Sony. |
- Official Launching of iPS (Innovative Production System). |
2006 |
- Implementation of Restriction Of the use of certain Hazardous Substances (RoHS). |
- Started Wafer Backgrinding. |
- Design Department expansion for Package Design for Power MOSFET, QFN (LFMAP) mass production. |
2007 |
- Received TS16949 Accreditation. |
2008 |
- Formation of Renesas Semiconductor Design (Malaysia) Sdn. Bhd. with Multimedia Super Corridor (MSC) Status. |
- RSM 35th. Anniversary Celebration |
- Started production of WPAK Device and AI. Ribbon Bonding. |
- Expansion of RSK Phase 6. |
2009 |
- Combined Re-Certification Audit for MS ISO14001:2004 and OHSAS18001:2007 Certification from SIRIM. |
- Q1 Line Linear IC |
- Setting up of DR MOS Line. |
- Started production of DR MOS with Cu-Clip Bonding. |
- Developed Cu Wire Bonding for Jedec SOP-8pin (Std Linear). |
- Launched CKP Project for Material Cost Reduction. |
- Formation of New Product Development Department. |
2010 |
- Started Production of Combo IC with Cu Wire Bonding. |
- Surpassed 100 Million pieces of Production for Power Devices. |
- Formation of Learning & Development Academy (LADA). |
- Launching of Kaizen15, Cost Reduction Project. |
2012 |
- Launching of Kaizen Innovative Team (KIT)- an enhancement of RSM's Small Group Activity. |
- Launching of Single Minute Exchange of Die (SMED) Programme- to achieve Quick Change Over in our operation. |
2013 |
- Launching of Hito Sensor. |
- Launching of RSM Skill Management System (RSMS). |
2014 |
- Launching of LITE project. |