1972	- Establishment of HISEM with a capital of RM2 Million.
1975	- Official opening of "HISEM" by Chief Minister of Penang.
	- Production of Bipolar IC.
1978	- Setting up "Small Signal Transistor" Production.
1980	- Setting up of HISET 1st. Subsidiary.
	- Production of MOS Memory.
1981	- Setting up of 2nd. Subsidiary HISAH in Kulim, Kedah.
	- Production of MPAK Transistors.
1987	- Production of memory SOP and Bipolar Digital Devices.
1988	- Production of Silicon Glass Diode and Microprocessor.
1990	- Setting up of Design Center.
	- Production of MPAK Diode.
1993	- HISEM receives the MS ISO9002 accreditation from SIRIM.
	- HISEM celebrates her 20th. Anniversary.
1994	- HISEM receives the "1994 National Occupational Safety & Health" Award from the Prime Minister.
	- HISAH receives the MS ISO9002 accreditation from SIRIM.
1996	- Setting up of the Traning Center.
1997	- Received the Environmental Management System (ISO14001) certification from SIRIM.
	- HISEM celebrates her 25th. Anniversary.
	- Production of UFP Diode.
1999	- Received the Prime Minister's Hibiscus Award for notable achievement in environmental performance.
2000	- Received the Occupational Safety & Health Management System (OHSAS18001) certification from SIRIM.
2001	- HISEM Employees Cooperative receives a Quality Award from the Penang Cooperative Development Department.
2002	- Production of Power Transistors.
2003	- Hitachi Semiconductor (Malaysia) Sdn. Bhd. - Name was changed to Renesas Semiconductor (Malaysia) Sdn. Bhd. (RSM).
	- Hitachi Semiconductor (Kedah) Sdn. Bhd. - Name was changed to Renesas Semiconductor (Kedah) Sdn. Bhd. (RSK).
	- RSM received a recognition award from the Penang State Department of Irrigation and Drainage for the Environmental project on the placement of trees along the Sungai Ara river bank.
	- RSM Employees Cooperative receives another Quality Award from the Penang Cooperative Development Department.
	- ISO9001:2000 Quality Management System Upgrade.
2004	- Setup of Operator Training Center (OTC).
	- Started WPAK Production.
	- started LFPAK and VQFN Production.
2005	- Expansion of RSM-Design Center to Level 3.
	- Received Green Partner Certificate from Sony.
	- Official Launching of iPS (Innovative Production System).
2006	- Implementation of Restriction Of the use of certain Hazardous Substances (RoHS).
	- Started Wafer Backgrinding.
	- Design Department expansion for Package Design for Power MOSFET, QFN (LFMAP) mass production.
2007	- Received TS16949 Accreditation.
2008	- Formation of Renesas Semiconductor Design (Malaysia) Sdn. Bhd. with Multimedia Super Corridor (MSC) Status.
	- RSM 35th. Anniversary Celebration
	- Started production of WPAK Device and AI. Ribbon Bonding.
	- Expansion of RSK Phase 6.
2009	- Combined Re-Certification Audit for MS ISO14001:2004 and OHSAS18001:2007 Certification from SIRIM.
	- Q1 Line Linear IC
	- Setting up of DR MOS Line.
	- Started production of DR MOS with Cu-Clip Bonding.
	- Developed Cu Wire Bonding for Jedec SOP-8pin (Std Linear).
	- Launched CKP Project for Material Cost Reduction.
	- Formation of New Product Development Department.
2010	- Started Production of Combo IC with Cu Wire Bonding.
	- Surpassed 100 Million pieces of Production for Power Devices.
	- Formation of Learning & Development Academy (LADA).
	- Launching of Kaizen15, Cost Reduction Project.
2012	- Launching of Kaizen Innovative Team (KIT)- an enhancement of RSM's Small Group Activity.
	- Launching of Single Minute Exchange of Die (SMED) Programme- to achieve Quick Change Over in our operation.
2013	- Launching of Hito Sensor.
	- Launching of RSM Skill Management System (RSMS).
2014	- Launching of LITE project.

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